Sn62Pb36Ag2 Solder Paste

Sn62Pb36Ag2 Mid Temperature Tin Lead Solder Paste

Our Sn62Pb36Ag2 is a type of mid temperature tin lead solder paste. It means that the alloy is formed by the 62% tin content, the 36% lead content, and the 2% silver content. Its working temperature can be classified as the preheat temperature from 90℃ to 150℃, the melting temperature of 183℃, and the reflow temperature from 190℃ to 100℃. Therefore, this product is suitable for the highly demanding reflow-soldering work.

The Sn62Pb36Ag2 solder paste is one of the leaded products developed by our company. It conforms to the surface mount technology within the electronics industry. Our product has been exported to Canada, India, Russia, Brazil Vietnam, and other countries. Furthermore, we are seeking agents on a global scale. Welcome to contact us, if you are interested in our product.

Scope of Application
This Sn62Pb36Ag2 mid-temperature leaded solder paste is ideal for use in the PCB, SMT, LED circuit boards, various lighting fixtures, computer motherboards, phone motherboards, and a variety of precise circuit boards.

Prominent Characteristics

 Our Sn62Pb36 mid temperature tin lead solder paste features extremely good weldability. It can offer nice wetting property on the substrate made from different materials.

 The original shape will keep unchanged even after several hours of the printing process. Additionally, the surface mount assembly will not be affected.

 The viscosity is rarely changed during the continuous printing process. Also, it will not be altered, even after 24 hours of operation of the steel mesh. Moreover, our product can still maintain the favorable and continuous printing effect.

 Thanks to superb fluidity and nice soldering effect, our product can accomplish the exquisite printing of the pad, the separation distance of which can be only 0.3mm.

Technical Data Sheet

Related Names
Silver Brazing Paste | Tin Lead Soldering Paste | Soft Metal Solder Paste