Sn42Bi58 Low temperature solder paste
The Sn42Bi58 is a common lead free solder paste with an alloy composed of 42% tin and 58% bismuth. It has a preheat temperature from 90℃ to 110℃, melting point of 138℃, and the reflow temperature range from 150℃ to 100℃. It is suitable for the demanding reflow-soldering process.
The activated flux in this product delivers superior fluxing effects. The solder paste was developed for soldering electrical devices at low temperatures. With good wetting properties and soldering performance, it is commonly used for soldering LED circuit boards.
This type of product has passed SGS tests and also holds numerous certifications, such as RoHS and REACH. It is also accompanied with the related material safety data sheet and abrasives as MSDS. The Sn42Bi58 Low temperature solder paste has been exported to such countries as, Iran, Colombia, Italy, etc. What’s more, we are seeking agents on a global scale. Please don’t hesitate to contact us if you are interested in our products.
Application
Ideal for use in PCB, SMT, plug-in components, computer motherboards, phone motherboards, LED circuit boards, diversified lighting fixtures, as well as all sorts of high-precision circuit boards.
Optimal choice for repairing small electronic equipment.
Suitable for lead-free hot tin dipping and the soldering of various components.
Can be used for multiple special soldering techniques.
Qingye Solder can customize lead-free solder paste according to your actual production conditions.
Features
With nice fluidity and good soldering effect, the solder paste can accomplish the exquisite printing of circuit components, the separation distance of which can be only 0.2mm.
There are very few changes of viscosity during the continuous printing process. The viscosity will not be altered, even after 12 hours of operation of the steel mesh.
The original shape will not be changed after several hours of printing process. In addition, the surface mount assembly will not be affected.
Favorable wetting property on the substrate made from different materials. Thanks to good soldering performance, it performs well on all kinds of coating surfaces.
With excellent fine pitch printing capability, it can successfully operate reflow soldering in air or in helium. It features high reliability, even if it is not cleaned after the reflow soldering process.
Made of lead-free alloy with little oxidation and activated flux, its viscosity suits printing and dispensing processes.
Through special flux, the solder paste has minimal residue with light color after soldering.
Technical data sheet
Specification | Sn42Bi58 |
Appearance | Adhesive paste in grayish black |
Weight | 500g/bottle, 10kg/box |
Chemistry component
Type | Chemical composition (wt.%) |
Sn | Bi | Sb | Pb | Fe | Al | Cd |
Sn42-Bi58 | 42±0.5 | 58±0.5 | < 0.02 | < 0.01 | < 0.02 | < 0.002 | < 0.003 |
Physical Speciality
Type | Melting Point(℃) | Spec. Gravity (g/cm3) | Tensile Strength (Mpa) |
Sn42-Bi58 | 138℃ | 8.72g/cm3 | 22HB |
Standard Paste Composition
Application | Type | Diameter | Content |
Standard printing | Alloy powder 3 | 25~45 μm | 89 % |
Fine pitch printing | Alloy powder 4 | 20~38 μm | 88.5 % |
Instill | Alloy powder 3 | 25~45 μm | 85 % |
Recommended process parameters
Temperature rise speed | The time taken to get to 110 ℃ | Constant temperature of 110 – 138 ℃ | Peak temperature | > 138℃ | Cooling speed |
1-3 ℃/sec | < 60-90 sec | 60-100 sec | 175±5 ℃ | < 30-60 sec | < 4 ℃/sec |
Related Names
Silver Brazing Paste | Tin Lead Soldering Paste | Soft Metal Solder Paste
