The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
QY803 series solder paste was developed by Qingye company,which provide excellent and printbility to meet customer’s needs.The QY803 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
Product features:
The product is colorless and transparent residue, moderate activity, low BGA void rate, manual printing is effortless, mainly used in high-end products, such as DVD, set-top box and so on
Solder Specfications
Composition of solder alloy
Composition(Mass%) |
SN | AG | CU |
Balance | 0.3±0.2% | 0.7±0.1% |
Solder alloy physical properties
Melting points(°C) |
Liquidus | DSC peak | Solidus |
227.0 | 220.0 | 277.0 |
Density（g/cm3）
|
Tensile Strength（Mpa）
|
Elongation（%）
| （Gpa）
Young’s Module |
0.2%Yield Point（Mpa）
|
Vickers Hardness（Hv）
|
7.39 | 53.3 | 49 | 41.6 | 39.4 | 18.9 |
Solder powder specification
Type | Mesh | PSD(um) |
T4 | -400/+635 | 20-38 |
Technical data：
Physical properties
Ctegory | Values/Results | Methods/Remarks |
Appearance
| Shall not have separarated flux,and shall be in smooth paste state | Visual inspection |
Metal Loading%
| 88.50 | JIS –Z- 3197 8.1.2 |
Viscosity Pa.S
| 170±30 pa.s | JIS-Z-3284 6@ Malcom PCU-205:10 rpm 3 min 25±1°C＜60% RH |
Tack | Initial:75.6 gm Takc retention @ 24 hr: 120.2 gm Tack retention @ 72 hr: 96 gm | JIS- Z- 3284 9 |
Spread Test% | ＞80% | JIS-Z-3197-8.3.1.1 |
Solder Ball Test | Acceptable | JIS-Z-3284 11 |
Slump Test | No bridges all spcings | JIS-Z-3284 7,8 |
Stencil Life | ＞8Hours | @50%RH,23°C（74°F） |
A bandon Time | 30-60 Minutes | @50%RH,23°C(74°F) |
Chemical properties
Activity Level | ROL0 | IPC J-STD-004 |
Halide content ppm | ＞1500ppm | JIS Z-3197 8.1.4.2.1 |
Copper Mirror | No removal of copper film | JIS Z-3197 8.4.2 |
Copper Corrosion | NO Corrosion Occur | IPC-TM-650 2.6.15 |
Electrical performance
SIR | Ordinary state 1×1012(Ω)or above After humidifying 1×109(Ω)or above After 100hrs.in humidity | JIS Z 3284-14 |
Electromigration | Pass,Tess Conditions:65°C，88.5% RH for 596 hrs | IPC-TM-650,2.6.14.1 |
