The tin electrode is generally used for wave soldering or small tin furnace dip welding, and the specifications of the solder bar are divided into the following two kinds according to the lead-free solder bar: 1. Lead solder bar: an alloy of tin and lead with a melting point of 183 degrees. 2. Lead-free solder bar: made of tin-copper alloy. Common lead-free environmental protection solder, according to the composition of different, respectively, tin copper (Sn-0.7Cu), tin silver copper (Sn-0.3Ag-0.5Cu), tin silver copper (Sn-3.0Ag-0.5Cu).
According to the chemical properties, the common types of solder bars are oxidation resistant solder bars and high purity and low slag solder bars. Anti-oxidation solder bar: has good anti-oxidation ability, high fluidity, strong weldability, very little scum when melting, very little oxidation in immersion and wave welding, is an economic solder bar for saving tin. Excellent wettability and weldability, full solder joint, uniform welding effect is excellent.
High purity and low slag solder bar: The raw material used is 100% electrolytic tin, lead or tin-lead alloy. Cast or extruded. Thus contributing to its stable characteristics of high weight, ultra-low slag and high wettability, so that it can be adapted to various welding processes.
◆ Anti-oxidation solder bar
It has good oxidation resistance, high fluidity, strong weldability, very little scum when melting, very little oxidation in immersion and wave welding, and is an economical solder bar for saving tin. Excellent wettability and weldability, full solder joint, uniform welding effect is excellent.
◆ High purity and low slag solder bar
The raw material used is 100% electrolytic tin, lead or tin-lead alloy. They are then molded or extruded. Thus, it contributes to the characteristics of stable high weight, ultra-low slag and high wettability, making it suitable for various welding processes.
◆ High temperature solder bar, low temperature solder bar
The liquidus temperature is higher than the tin lead eutectic melting point (183 ° C) is called high temperature tin strip, high temperature tin strip is formed by adding a higher proportion of silver, antimony or lead to the solder alloy, and is mostly used for the assembly of components that do not change during the assembly of the host board.
The liquidus temperature below the eutectic melting point of tin lead (183℃) is called low temperature tin strip. The low temperature tin strip is formed by adding bismuth, indium, cadmium and other components to the tin-lead alloy. It is mainly used for the assembly of parts with poor heat resistance such as microelectronic sensors.
